Job Description

About the Role

We are seeking an experienced Senior Manager, Package & Board Team to lead the design and development of advanced IC packaging and board-level solutions. This role will drive technology strategy, technical execution, and team development to deliver high-performance, cost-effective, and reliable semiconductor products.

Key Responsibilities

• Lead the Advanced Package & Board Design Team across substrate, interposer, and PCB design.

• Define packaging and board technology strategies aligned with product roadmaps.

• Establish design and verification methodologies for advanced packaging, including 2.5D, fan-out, and chiplet integration.

• Oversee interposer, substrate, and system board design from concept through production.

• Drive chiplet, HBM, and passive component integration, including package co-design with silicon teams.

• Ensure signal integrity, power integrity, mechanical, thermal, and reliability requirements are met.

• Manage board-level designs for system bring-up, test platforms, and reference designs.

• Work with OSATs, substrate suppliers, PCB manufacturers, and EDA vendors on design flows, validation, and production readiness.

• Manage project resources, schedules, and budgets while driving multiple programmes.

• Build and mentor a multidisciplinary engineering team and foster cross-functional collaboration.

Key Requirements

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field; PhD preferred.

• At least 15 years of experience in IC packaging, substrate/board design, or hardware system integration.

• Proven leadership experience managing multidisciplinary engineering teams and projects.

• Hands-on experience with 2.5D/3D integration, chiplet-based design, and advanced packaging technologies.

• Strong knowledge of signal and power integrity, mechanical and thermal analysis, and reliability validation.

• Experience working with OSATs, substrate suppliers, and EDA tools such as Cadence, Mentor, or Ansys.

• Understanding of design automation, DFM/DFT, and production ramp-up processes.

• Strong technical, strategic, problem-solving, and communication skills.

• Ability to manage multiple programmes and deliver under tight schedules.