Job title: Senior Manager, Package and Board Team
Job type: Permanent
Emp type: Full-time
Job published: 27-10-2026
Job ID: 44255

Job Description

About the Role

We are seeking an experienced Senior Manager, Package & Board Team to lead the design and development of advanced IC packaging and board-level solutions. This role will drive technology strategy, technical execution, and team development to deliver high-performance, cost-effective, and reliable semiconductor products.

Key Responsibilities

  • Lead the Advanced Package & Board Design Team across substrate, interposer, and PCB design.

  • Define packaging and board technology strategies aligned with product roadmaps.

  • Establish design and verification methodologies for advanced packaging, including 2.5D, fan-out, and chiplet integration.

  • Oversee interposer, substrate, and system board design from concept through production.

  • Drive chiplet, HBM, and passive component integration, including package co-design with silicon teams.

  • Ensure signal integrity, power integrity, mechanical, thermal, and reliability requirements are met.

  • Manage board-level designs for system bring-up, test platforms, and reference designs.

  • Work with OSATs, substrate suppliers, PCB manufacturers, and EDA vendors on design flows, validation, and production readiness.

  • Manage project resources, schedules, and budgets while driving multiple programmes.

  • Build and mentor a multidisciplinary engineering team and foster cross-functional collaboration.

Key Requirements

  • Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field; PhD preferred.

  • At least 15 years of experience in IC packaging, substrate/board design, or hardware system integration.

  • Proven leadership experience managing multidisciplinary engineering teams and projects.

  • Hands-on experience with 2.5D/3D integration, chiplet-based design, and advanced packaging technologies.

  • Strong knowledge of signal and power integrity, mechanical and thermal analysis, and reliability validation.

  • Experience working with OSATs, substrate suppliers, and EDA tools such as Cadence, Mentor, or Ansys.

  • Understanding of design automation, DFM/DFT, and production ramp-up processes.

  • Strong technical, strategic, problem-solving, and communication skills.

  • Ability to manage multiple programmes and deliver under tight schedules.