Job Description
Job Responsibilities
- Provide technical support to key PCB customers on CCL material selection, application, and performance-related issues.
- Drive customer qualification, certification, and the introduction of new materials.
- Lead NPI and new project technical activities, supporting successful commercialization and sales conversion.
- Conduct PCB defect analysis, troubleshooting, and root cause investigations to resolve technical challenges.
- Collaborate closely with customer R&D, Process, Quality, and Engineering teams on technical matters.
- Coordinate with internal R&D, Quality, Manufacturing, and Sales teams to ensure timely resolution of customer issues.
- Track developments in PCB/HDI technologies and CCL material trends to identify potential business opportunities.
- Deliver technical support and customer engagement across Malaysia, Singapore, and the wider ASEAN region.
Job Requirements
- Bachelor’s Degree in Engineering, Science, Materials Science, Chemical Engineering, Electrical Engineering, or a related discipline.
- Minimum 5 years of experience in PCB R&D, Lamination, Process Engineering, or NPI within a reputable PCB manufacturing environment; or
- Minimum 4 years of experience in Technical Support, Field Application Engineering (FAE), or Application Engineering with a leading CCL manufacturer.
- Strong understanding of PCB manufacturing processes, including HDI production flow.
- Good knowledge of CCL materials, their properties, and application requirements.
- Proven ability to perform PCB defect analysis, troubleshooting, and problem resolution.
- Capable of independently identifying root causes and implementing effective technical solutions.
- Experience in customer qualification, material certification, and new product introduction (NPI) activities is an added advantage.
- Proficient in both Mandarin and English, with strong verbal and written communication skills.